Samsung’s HBM Lag: Why the Tech Giant Lost Round One to SK Hynix (And Its HBM4 Plan to Win the War)

A vibrant, glowing HBM (High Bandwidth Memory) chip stack with multiple layers, resting on a circuit board. The background shows blurred cleanroom engineers and lab equipment, symbolizing advanced semiconductor manufacturing. The chip base is labeled "SAMSUNG" and "SK HYNIX."

The HBM War: SK Hynix Won the Battle, Samsung Plans to Win the War The global AI revolution runs on High Bandwidth Memory (HBM). In the critical battle for HBM3E, SK Hynix has secured a decisive—and, to many, surprising—lead, appearing to dethrone the long-reigning champion, Samsung. However, from a perspective on the ground in Seoul, … 더 읽기

Samsung to Launch Next-Generation 16-Layer High Bandwidth Memory in the Coming Year

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During an interview with Samsung’s Semiconductor Newsroom on April 18, Yun Jae-yun, Executive Vice President of DRAM Development at Samsung Electronics, announced the company’s adoption of advanced Non-Conductive Film (NCF) assembly technology, which is optimized for high-temperature thermal characteristics. This breakthrough will be integral to their next-gen HBM4, employing a 16-layer stack technology, referred to … 더 읽기