The HBM War: SK Hynix Won the Battle, Samsung Plans to Win the War The global AI revolution runs on High Bandwidth Memory (HBM). In the critical battle for HBM3E, SK Hynix has secured a decisive—and, to many, surprising—lead, appearing to dethrone the long-reigning champion, Samsung. However, from a perspective on the ground in Seoul, … 더 읽기
Samsung Electronics has recently made a significant change in its leadership, appointing Young-Hyun Jun as the new head of its Device Solutions (DS) division. This strategic move comes in the wake of substantial financial losses in the semiconductor sector, aiming to rejuvenate the company’s approach and enhance its future competitiveness. In the past year, Samsung’s … 더 읽기
During an interview with Samsung’s Semiconductor Newsroom on April 18, Yun Jae-yun, Executive Vice President of DRAM Development at Samsung Electronics, announced the company’s adoption of advanced Non-Conductive Film (NCF) assembly technology, which is optimized for high-temperature thermal characteristics. This breakthrough will be integral to their next-gen HBM4, employing a 16-layer stack technology, referred to … 더 읽기
