Samsung to Launch Next-Generation 16-Layer High Bandwidth Memory in the Coming Year

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During an interview with Samsung’s Semiconductor Newsroom on April 18, Yun Jae-yun, Executive Vice President of DRAM Development at Samsung Electronics, announced the company’s adoption of advanced Non-Conductive Film (NCF) assembly technology, which is optimized for high-temperature thermal characteristics. This breakthrough will be integral to their next-gen HBM4, employing a 16-layer stack technology, referred to … 더 읽기

Navigating the Surge in Electric Vehicle Battery Capacity: Trends and Implications for Global Markets

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The electric vehicle (EV) landscape is witnessing a transformative shift, characterized by a notable increase in the average battery capacity. Despite a slowdown in the growth rate of EV demand, the trend towards vehicles equipped with larger-capacity batteries marks a pivotal moment in the evolution of electric mobility. This post explores the intricacies of this … 더 읽기